Semiconductor and Opto-electronics Equipment and MFG

Advanced Ion Beam Technology, Inc. (Taiwan)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

Sumitomo (Japan)

  • Ion Implantation: Ion Implanters and Plasma Doping

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Boston Process Technologies, Inc. (United States)

Fluxless Thermo-Compression Bonder & AXI+

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray



Hermes Testing Solutions Inc.

EXOJET Technology Corporation

  • Solar Cell Conductive Pastes
  • Conductive Pastes for Passive Components
  • Pastes for Printed Wire Board
  • Pastes for Flexible Circuitry
  • Printing Inks for Touch Panel
  • Pastes for Lighting/Display

Taiwan Electron Microscope Instrument Corporation (Taiwan)

Desktop Scanning Electron Microscope & Liquid-Phase Inspection Modules

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.


ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

TC TECH Sweden AB (Sweden)

A patented unique system for the production of light guide plates

  • TCP 1000 HT/HP; 150 HPE; 100 HP
  • TCP EE, Edge Embossing

Cowin DST CO, LTD. (Korea)

  • FPD: Light Leakage Repair System; Pad Pattern Repair System; Half Tone Photo Mask Repair System
  • PV: Laser Selective Emitter Doping & Real Metal Contact
  • TSP: Laser Direct Patterning System; Cover Glass Hole Drilling & Edge Polishing System

Components and Materials


  • Si ingot


  • Si parts
  • SiC Ingot, Sic Substrate
  • Chiller (New & Repair)
  • RF, RPS (Remote Plasma Source)


  • E-Chuck repair.
  • RPS repair.
  • Hard aluminum anodized film rebuild.

NvisANA (Korea)

Wafer Impurity Contamination Monitoring System

  • In-Line Wafer Metallic Contamination Monitoring System
  • In-Line Wafer Ionic Contamination Monitoring System
  • In-Line Wafer Organic Contamination Monitoring System
  • Automated Metallic Impurity Monitoring System For Gas and Chemical


  • Quartz


  • Silicon parts: CEL, Focus Ring

Fujikin Incorporated (Japan)

  • Parts: FCS ( Flow Control System ), IGS (Integrated Gas System )

Benchmark Technologies (United States)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

Biomedicine & Medical treatment

  • DNA sensor chip
  • Biochip IVD scanner
  • BNCT treatment
  • Proton Therapy
  • Pesticide residue diagnosis
  • Blood pump implant for heart failure patients
  • Electronic eyes and ears
  • Nano wire-FET bio-sensing platform
  • Electronic medicine
  • Cancer immunotherapy
  • Epidemic screen

Energy efficiency

  • WBG semiconductor
  • GaN-based power management technology
  • SiC device design house
  • Automobile turbo charger
  • BLDC motor and control design and manufacturing
  • BLDC MCU + gate drivers + power MOS

AIoT and Life

  • Design and creative
  • Anti-Bacterial Yarn & C0 DWR Process
  • Water repellent fabric chemical & process
  • Smart-tinting glass